SMT and THT total approximately
350.000 pieces component assembly
capacity / hour
No Clean And Lead Free
No clean and lead
IPC-A-610 & IPC J-STD-001
Automated Optical Inspection (AOI)
In line automated optical inspection is applied for all boards just after SMT reflow process to detect soldering, misplacement, orientation and polarity defects.
Solder Paste Inspection
Chemical cleaning is available for the assemblies as per customer request.
0201 / 42mm
Component range : up to 0201
chips and 42mm IC.
Soldering with Nitrogen
To obtain better solder joints, Nitrogen atmosphere is used in reflow ovens and wave soldering machines to avoid oxidation during soldering process.
Ultra-fine pitch ,QFP,QFN, BGA,CSP
micro BGA assembly
Aging Test (Temp/Humidity Chamber)
As per customer request, temperature cycling test can be applied for the assemblies
Flying Probe Test
Flying probe test equipment is used for very small batches or prototype assemblies. This enables to avoid fixture investment for very low volume production
Automated conformal coating is applied to the boards to eliminate harsh environmental impact for industrial and defense products according to customer request.
RoHS compliant assembly
50 x 40
1200 x 350mm
PCB size : 50mm x 40mm
1200mm x 350mm
ICT Test & FCT Test
100% test is applied for all assemblies. High end test technologies (i.e. HP3070) are in place to test the boards. In-circuit and functional tests are performed as per customer request. Test development can also be provided to our customers.